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Numerical modeling of vacuum-assisted resin transfer molding using multilayer approach
Raounak Loudad, Abdelghani Saouab, Pierre Beauchene, Romain Agogue, Bertrand Desjoyeaux

Numerical modeling of vacuum-assisted resin transfer molding using multilayer approach

Science & Mathematics Published 2017 Verification Pending

Overview & Synopsis

Vacuum-assisted resin transfer molding (VARTM) is a very suitable solution for composite manufacturing industry. It allows the manufacturing of large and complex shape parts at low costs. However, the simulation of this process is complicated due to myriad physical phenomena involved, specifically the strong coupling between the resin flow and the preform compressibility, i.e. hydro-mechanical coupling. Moreover, the use of the distribution medium involves two types of flow: Planar flow and through-the-thickness flow. These flows cannot be considered together by a 2D model. On the other hand, 3D models require an important amount of computation time. This article presents a VARTM modeling approach that takes into account the hydro-mechanical coupling and the coexistence of planar and transverse flows. The proposed modeling approach allows the simulation of the infusion process in the case of multilayer preform with different materials and orientations, including the distribution medium. This model is validated experimentally based on several infusions.

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Document Information

Document Title Numerical modeling of vacuum-assisted resin transfer molding using multilayer approach
Author / Organization Raounak Loudad, Abdelghani Saouab, Pierre Beauchene, Romain Agogue, Bertrand Desjoyeaux
Subject & Discipline Multidisciplinary Academic Open Research
Categories Science & Mathematics
Publication Year 2017
License / Rights Open Access / Creative Commons
Resource Verification Listed PDF (Verification Pending)
Original Host Website HAL Open Science (hal.science)
File Format application/pdf (Portable Document Format)
Language EN
Catalog ID DOC-217483
Original Source Link Visit Source Page on hal.science »