HIGH DENSITY OUT-OF-PLANE MICROPROBE ARRAY
Overview & Synopsis
MEMS technology has been developed rapidly in the last few years. More and more special micro structures were discussed in several publications. However, all of the structures were produced by consist of the three fundamental structures, which included bridge, cantilever and membrane structures. Even the more complex structures were no exception. The cantilever with the property of simple design and easy fabrication among three kinds of fundamental structure, therefore, it was popular used in the design of MEMS device.
Indexed from repository: HAL Open Science
(
hal.science)
Keyboard Shortcuts:
← / → for pages • + / - for zoom • 0 to fit width
Powered by Mozilla PDF.js v3.11
Document Information
| Document Title | HIGH DENSITY OUT-OF-PLANE MICROPROBE ARRAY |
|---|---|
| Author / Organization | Huang C.H. Huang C.H., Chingfu Tsou, Tenghsien Lai |
| Subject & Discipline | Multidisciplinary Academic Open Research |
| Categories | Science & Mathematics |
| Publication Year | 2008 |
| License / Rights | Open Access / Creative Commons |
| Resource Verification | Listed PDF (Verification Pending) |
| Original Host Website |
HAL Open Science
(hal.science)
|
| File Format | application/pdf (Portable Document Format) |
| Language | EN |
| Catalog ID | DOC-235204 |
| Original Source Link | Visit Source Page on hal.science » |